Best-in-class shadow free 3D paste measurement from the world’s leader in test and measurement. The Medalist SP50 Series 3 Dual Laser system is the latest generation in high performance 3D solder paste inspection. Opposing high incident angle lasers eliminate hidden paste, or “shadow effect”, regardless of paste deposit shape.
The SP50 Series 3 Features:
Options:
|
Functionality and capability: |
|
| 2D and 3D solder paste | Volume, area, height, XY offset, bridge measurement detection |
| Speed of operation
Inspection speeds may vary with software setting changes; contact your Agilent sales representative for details. |
Fiducial inspection – Typically less than 5 seconds
Load/unload – Typically less than 5 seconds 3D scanning speed – Up to 38.7 cm2/sec (6 in2/sec) |
Gauge repeatable and reproducibility capability
|
< 10% GR & R at typical process widths
Typically 1% on target plate at 5.15 Sigma, ±50 μm spec Typically 5% on actual board at 5.15 Sigma, ±50 μm spec |
| Paste types supported | All paste types, including lead-free |
| Board and pad finishes supported | Typical pad fi nishes: HASL, Nickel Gold, organic, etc.
Typical board fi nishes: all solder masks and colors |
|
Board dimensions: |
SP50 Series 3 |
| Maximum board size | 510 mm by 510 mm (20″ by 20″) |
| Minimum board size | 50 mm by 50 mm (2″ by 2″) |
| Maximum board thickness | 4 mm (0.16″) |
| Minimum board thickness | 0.5 mm (0.02″) |
| Maximum inspectable area | 495 mm by 495 mm (19.5″ by 19.5″) |
| Board weight | Up to 3 kg (6.6 lb) |
Clearance
|
6 mm (0.24″)
50 mm (1.97″) 3.5 mm (0.14″) 821 mm to 965 mm (32″ to 38″) |
|
System dimensions: |
SP50 Series 3 |
| Width | 1004 mm (3.3 ft) |
| Depth | 1423 mm (4.7 ft)2 |
| Height | 2210 mm (7.3 ft)3 |
| Weight | ~1150 kg (2535 Ib) |